Rectangular Connectors - Headers, Specialty Pin

Rectangular Connectors - Headers, Specialty Pin

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Manufacturer
Series
Features
Packaging
Mounting Type
RoHS Status
Manufacturer Part Number
Contact Finish
Contact Finish Thickness
Number of Positions

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Image Part Number Manufacturer Description Series Features Packaging Mounting Type RoHS Status Manufacturer Part Number Contact Finish Contact Finish Thickness Number of Positions
480-10-258-00-001000 Mill-Max HEADER DUAL INLINE SOLDRTL 58POS 480 - Bulk Through Hole - - Gold 10.0µin (0.25µm) 58
173-10-636-00-001000 Mill-Max HEADER OPEN TURR 3LVL.600 36POS 173 - Tube Through Hole - - Gold 10.0µin (0.25µm) 36
134-10-640-00-100000 Mill-Max HEADER OPEN .030"DIA .600 40POS 134 - Tube Through Hole - - Gold 10.0µin (0.25µm) 40
04-0600-10 Aries Electronics, Inc. 0600 STRIP-LINE HDR COINED CNTCT 0600 - Bulk Through Hole - - Tin 200.0µin (5.08µm) 4
150-80-648-00-001101 Preci-Dip DIL SURFACE MOUNT 2.54MM 150 - Bulk Through Hole - - Tin - 48
334-90-146-00-100000 Mill-Max CONN HDR PIN 334 - Bulk Through Hole RoHS non-compliant - Tin-Lead 200.0µin (5.08µm) 46
22-0625-31 Aries Electronics, Inc. 0625 PIN-LINE HDR SCRW MACH CONT 0625 - Bulk Through Hole - - Gold 10.0µin (0.25µm) 22
334-10-151-00-000000 Mill-Max CONN HDR PIN 334 - Bulk Through Hole RoHS Compliant - Gold 10.0µin (0.25µm) 51
26-6625-21 Aries Electronics, Inc. 625 DIP HDR SCRW MACH CONTACT 625 - Bulk Through Hole - - Gold 10.0µin (0.25µm) 26
363-10-144-00-001101 Preci-Dip HEADER WIRE WRAP 2.54MM 363 - Bulk Through Hole - - Gold 10.0µin (0.25µm) 44

About Rectangular Connectors - Headers, Specialty Pin


Rectangular connectors with specialty pin headers cater to unique applications where specific pin configurations are required. These headers are designed to accommodate specialized needs, such as high-density connections, signal integrity, or customized pin layouts. Specialty pin headers contribute to the versatility of rectangular connectors, enabling engineers to tailor their designs to meet specific industry standards or application requirements.