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| Image | Part Number | Manufacturer | Description | Series | Features | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Number of Positions | Color | Pitch |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 800-10-010-10-007000 | Mill-Max | SOLDER CUP HEADER, SINGLE ROW | 800 | - | Bulk | Through Hole | - | - | 10 | - | 0.100" (2.54mm) | |
| 373-10-155-00-001101 | Preci-Dip | HEADER TURRET WIRE WRAP 2.54MM | 373 | - | Bulk | Through Hole | - | - | 55 | Black | 0.100" (2.54mm) | |
| 470-80-230-00-001101 | Preci-Dip | HEADER TURRET 2.54MM | 470 | - | Bulk | Through Hole | - | - | 30 | Black | 0.100" (2.54mm) | |
| 180-10-432-00-001101 | Preci-Dip | DIL SOLDER TAIL 2.54MM | 180 | - | Bulk | Through Hole | - | - | 32 | Black | 0.100" (2.54mm) | |
| 383-10-121-00-001101 | Preci-Dip | HEADER WIRE WRAP 2.54MM | 383 | - | Bulk | Through Hole | - | - | 21 | Black | 0.100" (2.54mm) | |
| 334-90-111-00-100000 | Mill-Max | CONN HDR PIN | 334 | - | Bulk | Through Hole | RoHS non-compliant | - | 11 | Black | 0.100" (2.54mm) | |
| 150-10-308-00-106191 | Preci-Dip | DIL SURFACE MOUNT 2.54MM | 150 | - | Bulk | Surface Mount | - | - | 8 | Black | 0.100" (2.54mm) | |
| 150-80-328-01-899161 | Preci-Dip | DIL SURFACE MOUNT 2.54MM | 150 | - | Bulk | Surface Mount | - | - | 28 | Black | 0.100" (2.54mm) | |
| 151-10-642-00-009000 | Mill-Max | HEADER OPEN .018"DIA .600 42POS | 151 | - | Tube | Through Hole | - | - | 42 | Black | 0.100" (2.54mm) | |
| 162-10-428-00-180000 | Mill-Max | CONN HDR OPEN SLOTTED | 162 | - | Tube | Through Hole | RoHS Compliant | - | 28 | Black | 0.070" (1.78mm) |
Rectangular connectors with specialty pin headers cater to unique applications where specific pin configurations are required. These headers are designed to accommodate specialized needs, such as high-density connections, signal integrity, or customized pin layouts. Specialty pin headers contribute to the versatility of rectangular connectors, enabling engineers to tailor their designs to meet specific industry standards or application requirements.