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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MTSW-120-08-S-D-220-RA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 95665-436HLF | Amphenol FCI | HEADER BERGSTIK | BERGSTIK® II | - | - | - | - | Bulk | Through Hole | - | - | |
| TMM-144-01-S-S-RA-025 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| HMTSW-116-21-L-Q-100 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| MTSW-105-08-S-D-240 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| PRPN281PAEN | Sullins Connector Solutions | CONN HEADER 2MM SNGL STR 28POS | - | -40°C ~ 105°C | - | - | 1A | Bulk | Through Hole | - | - | |
| 0554560569 | Affinity Medical Technologies - a Molex company | MINI MI II SMT ASSYW/OBOSS5CKT | Mini Mi II 55456 | - | - | Solder Retention | - | Tape & Reel (TR) | Surface Mount, Right Angle | - | - | |
| LTMM-107-02-L-D-SM-02-K-TR | Samtec, Inc. | 2MM TERMINAL STRIPS | Flex Stack, LTMM | -55°C ~ 105°C | - | Keying Slot, Pick and Place | - | Tape & Reel (TR) | Surface Mount | - | - | |
| MTSW-145-08-F-D-340 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| TSW-118-05-S-D | Samtec, Inc. | CONN HEADER 36POS .100" DL GOLD | TSW | -55°C ~ 125°C | - | - | - | Bulk | Through Hole | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.