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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1-644750-5 | Agastat Relays / TE Connectivity | CONN HEADER 15POS VERT .156 TIN | MTA-156 | -55°C ~ 105°C | - | - | Varies by Wire Gauge | Bulk | Through Hole | - | - | |
| 44428-1402 | Affinity Medical Technologies - a Molex company | CONN HEADER 14POS 3MM R/A GOLD | Micro-Fit 3.0 BMI 44428 | - | - | Board Lock | - | Tray | Through Hole, Right Angle | - | - | |
| TMM-147-01-FM-D-RA-022 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| TMMH-121-04-H-DV | Samtec, Inc. | 2MM LOW PROFILE STRIPS | - | - | - | - | - | - | - | - | - | |
| MTSW-206-22-L-T-225-LA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| MTLW-106-22-G-D-270 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| MTSW-106-09-L-S-395-RA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 53261-0690 | Affinity Medical Technologies - a Molex company | CONN HEADER 6POS 1.25MM R/A SMD | PicoBlade 53261 | - | - | Solder Retention | - | Cut Tape (CT) | Surface Mount, Right Angle | - | - | |
| DF22-5P-7.92DS(06) | 4D Systems | CONN HEADER 5POS 7.92MM R/A TIN | EnerBee™ DF22 | -35°C ~ 85°C | - | Board Guide | 22A | Bulk | Through Hole, Right Angle | - | - | |
| MTMM-121-02-G-D-105 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.