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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TMMH-115-05-T-DV-TR | Samtec, Inc. | 2MM LOW PROFILE STRIPS | - | - | - | - | - | Tape & Reel (TR) | - | - | - | |
| MTSW-122-12-S-D-630 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 0444282406 | Affinity Medical Technologies - a Molex company | MICROFIT BMI RA DR HDR 30AU | Micro-Fit 3.0 BMI 44428 | - | - | - | - | Tray | Through Hole, Right Angle | - | - | |
| TSS-106-01-H-D | Samtec, Inc. | LOW PROFILE .025 SQ STRIPS | Flex Stack, TSS | -55°C ~ 125°C | - | Keying Slot | - | Tube | Through Hole | - | - | |
| TMM-146-01-T-D-SM | Samtec, Inc. | CONN HEADER 92POS DUAL 2MM SMD | TMM | -55°C ~ 105°C | - | - | 3.2A per Contact | Bulk | Surface Mount | - | - | |
| 1-1586495-4 | Agastat Relays / TE Connectivity | CONN HEADER 14POS VERT PCB TIN | AMP-DUAC | -55°C ~ 105°C | - | - | - | Bulk | Through Hole | - | - | |
| TSM-105-02-T-SV-LC | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 105°C | - | Board Lock | - | Tube | Surface Mount | - | RoHS Compliant | |
| 832-90-050-10-001000 | Mill-Max | CONN HDR DBL | 832 | - | - | - | - | Bulk | Through Hole | - | RoHS non-compliant | |
| HTST-107-01-H-D | Samtec, Inc. | HIGH TEMP TOP SHROUD | - | - | - | - | - | - | - | - | - | |
| 850-80-003-30-001191 | Preci-Dip | CONN HDR 3POS 1.27MM SMD | 850 | -55°C ~ 125°C | - | Pick and Place | 1A | Bulk | Surface Mount | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.