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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2010224024 | Affinity Medical Technologies - a Molex company | SLIM-GRID HEADER, 24 CIRCUITS, T | Slim-Grid 201022 | -55°C ~ 105°C | - | Pick and Place | - | Tube | Through Hole | - | - | |
| MTSW-220-24-L-D-290 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| MTLW-135-10-T-D-600 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| IPL1-110-01-F-D-P | Samtec, Inc. | .100 TERMINAL ASSEMBLY | - | - | - | - | - | - | - | - | - | |
| 87381-428HLF | Amphenol FCI | HEADER BERGSTIK | BERGSTIK® II | - | - | - | - | Bulk | Through Hole | - | - | |
| TSM-145-03-H-DV | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | - | - | Tube | Surface Mount | - | RoHS Compliant | |
| 86385-172HLF | Amphenol FCI | HEADER BERGSTIK R/A | BERGSTIK® II | - | - | - | - | Bulk | Through Hole, Right Angle | - | - | |
| 292231-6 | Agastat Relays / TE Connectivity | 1.5 MINI CT SGL V SMT W/O BOSS | Mini CT | -30°C ~ 105°C | - | - | Varies by Wire Gauge | Tape & Reel (TR) | Surface Mount | - | - | |
| MTLW-132-09-T-D-300 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| 1053111208 | Affinity Medical Technologies - a Molex company | NANO-FIT HDR VT SGL FRK 8CKT 15A | Nano-Fit 105311 | -40°C ~ 105°C | - | Board Guide, Board Lock | - | Tray | Through Hole | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.