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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 87690-2 | Agastat Relays / TE Connectivity | CONN HEADER 12POS .100 VERT GOLD | AMPMODU Mod II | - | - | - | - | Tray | Through Hole | - | - | |
| 15-42-6030 | Affinity Medical Technologies - a Molex company | CONN HEADER 30POS .100 VERT TIN | C-Grid 8723 | - | - | - | - | Tube | Through Hole | - | - | |
| TFML-112-01-S-D | Samtec, Inc. | .050 SHROUDED TERMINAL | Tiger Eye™ TFML | -55°C ~ 125°C | - | - | - | Tube | Through Hole | - | - | |
| 93167-125HLF | Amphenol FCI | HEADER BERGSTIK | BERGSTIK® II | - | - | - | - | Bulk | Through Hole | - | - | |
| TSM-104-04-T-SH-A-K | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 105°C | - | Board Guide, Pick and Place | - | Tube | Surface Mount, Right Angle | - | RoHS Compliant | |
| MTSW-122-24-H-D-290 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| TSM-108-02-L-DV-014-P | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | Pick and Place | - | Tube | Surface Mount | - | RoHS Compliant | |
| 890-18-018-20-002101 | Preci-Dip | CONN HDR 18POS 2.54MM T/H R/A | 890 | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole, Right Angle | - | - | |
| MTLW-115-10-G-D-110 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| TMM-147-01-LM-S-RA-007 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.