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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 0705430021 | Affinity Medical Technologies - a Molex company | CONN HEADER 22POS .100 VERT GOLD | SL 70543 | -40°C ~ 105°C | - | - | - | Tube | Through Hole | - | - | |
| TFM-120-02-L-D-A-TR | Samtec, Inc. | .050 X .050 MICRO STRIPS | Tiger Eye™ TFM | -55°C ~ 125°C | - | Board Guide | 2.9A per Contact | Tape & Reel (TR) | Surface Mount | - | - | |
| TSM-108-02-L-SH-A | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | Board Guide | - | Tube | Surface Mount, Right Angle | - | RoHS Compliant | |
| MTLW-102-06-G-D-110 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| 3-641118-9 | Agastat Relays / TE Connectivity | CONN HEADER 9POS R/A .156 GOLD | MTA-156 | -55°C ~ 105°C | - | - | Varies by Wire Gauge | Bulk | Through Hole, Right Angle | - | - | |
| MTMM-145-06-S-D-246 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| 2-917658-3 | Agastat Relays / TE Connectivity | CONN HEADR 12POS STR KEY-YY 30AU | Dynamic D-3200 | -55°C ~ 105°C | - | Board Lock | - | Bulk | Through Hole | - | - | |
| MTMM-132-07-T-S-240 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| HTST-118-04-L-D-RA | Samtec, Inc. | HIGH TEMP TOP SHROUD | - | - | - | - | - | - | - | - | - | |
| MTMM-108-05-G-D-210 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.