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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 802-90-062-10-001000 | Mill-Max | CONN HDR PIN | 802 | - | - | - | - | Bulk | Through Hole | - | RoHS non-compliant | |
| TSM-109-04-L-SV-LC | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | Board Lock | - | Tube | Surface Mount | - | RoHS Compliant | |
| MTMM-102-08-T-D-275 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| MTLW-132-09-G-D-380 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| FTE-109-01-G-DH | Samtec, Inc. | CONN HEADR 18POS .8MM DL R/A SMD | FTE | -55°C ~ 125°C | - | - | 2.7A per Contact | Bulk | Surface Mount, Right Angle | - | - | |
| MTSW-108-08-L-D-040 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 64991-G46-4R | Amphenol FCI | CONN HEADER | BergCon® | - | - | - | - | Tray | Through Hole | - | - | |
| DF3EA-4P-2V(51) | 4D Systems | CONN HEADER 4POS 2MM VERT GOLD | DF3 | -55°C ~ 105°C | - | Solder Retention | Varies by Wire Gauge | Tape & Reel (TR) | Surface Mount | - | - | |
| HMTSW-125-10-S-D-000 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| 2-644884-0 | Agastat Relays / TE Connectivity | CONN HEADER 20POS VERT .100 GOLD | MTA-100 | -55°C ~ 105°C | - | - | Varies by Wire Gauge | Bulk | Through Hole | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.