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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 802-90-042-10-001000 | Mill-Max | CONN HDR PIN | 802 | - | - | - | - | Bulk | Through Hole | - | RoHS non-compliant | |
| 5-146868-1 | Agastat Relays / TE Connectivity | CONN HEADER VERT .100" GOLD | AMPMODU | -65°C ~ 105°C | - | - | 3A | Tape & Reel (TR) | Through Hole | - | - | |
| TSS-117-03-G-D-LL-02 | Samtec, Inc. | LOW PROFILE .025 SQ STRIPS | Flex Stack, TSS | -55°C ~ 125°C | - | Keying Slot | - | Tube | Through Hole | - | - | |
| TSM-115-05-F-DV | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | - | - | Tube | Surface Mount | - | RoHS Compliant | |
| TMMH-117-01-S-DV-EP | Samtec, Inc. | 2MM LOW PROFILE STRIPS | - | - | - | - | - | - | - | - | - | |
| 5-146264-4 | Agastat Relays / TE Connectivity | CONN HDR BRKWAY DUAL 8POS .100 | AMPMODU Mod II | -65°C ~ 105°C | - | - | 3A | Bulk | Through Hole | - | - | |
| TSM-128-01-S-DV-P-TR | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | Pick and Place | - | Tape & Reel (TR) | Surface Mount | - | RoHS Compliant | |
| 77313-157-12LF | Amphenol FCI | BERGSTIK | BERGSTIK® | - | - | - | - | Bulk | Through Hole | - | - | |
| IPL1-102-02-L-D-K-TR | Samtec, Inc. | .100 TERMINAL ASSEMBLY | Mini Mate® IPL1 | -55°C ~ 125°C | - | - | - | Tape & Reel (TR) | Surface Mount | - | - | |
| TMM-103-02-L-D-006 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.