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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MTLW-104-07-F-D-135 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| FTS-131-01-S-D | Samtec, Inc. | .050 X .050 C.L. LOW PROFILE TER | FTS | -55°C ~ 125°C | - | - | 3.4A per Contact | Tube | Through Hole | - | - | |
| M20-9702045 | Harwin | 20+20 DIL HORIZ PIN HDR | M20 | -40°C ~ 105°C | - | - | 3A per Contact | Bulk | Through Hole, Right Angle | - | - | |
| MTLW-116-08-G-D-270 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| HMTSW-108-08-S-D-330 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| FTS-149-04-S-D | Samtec, Inc. | .050 X .050 C.L. LOW PROFILE TER | FTS | -55°C ~ 125°C | - | - | 3.4A per Contact | Tube | Through Hole | - | - | |
| TSM-122-01-S-DV-P-TR | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | Pick and Place | - | Tape & Reel (TR) | Surface Mount | - | RoHS Compliant | |
| TMM-136-01-G-S-SM | Samtec, Inc. | CONN HEADER 36POS SNGL 2MM SMD | TMM | -55°C ~ 125°C | - | - | 3.2A per Contact | Bulk | Surface Mount | - | - | |
| 2303-5151-TB | 3M | PIN STRIP HEADER 3 PIN RIGHT ANG | 2300 | -55°C ~ 105°C | - | - | 3A | Bulk | Through Hole, Right Angle | - | - | |
| MTMM-115-12-G-D-465 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.