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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MTSW-150-06-G-Q-100 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 961116-5604-AR | 3M | CONN HEADER R/A SGL 16POS GOLD | 961 | -25°C ~ 105°C | - | - | 2A | Bulk | Through Hole, Right Angle | - | - | |
| 98414-G06-08-A01LF | Amphenol FCI | CONN HEADER STRT | Minitek® | - | - | Keying Slot | 2A (AC/DC) | Bulk | Through Hole | - | - | |
| MTLW-106-08-L-S-365 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| TMM-116-01-FM-S-RA-006 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| 4-644629-5 | Agastat Relays / TE Connectivity | CONN HEADER 15POS R/A .156 GOLD | MTA-156 | -55°C ~ 105°C | - | Keying Slot | Varies by Wire Gauge | Bulk | Through Hole, Right Angle | - | - | |
| HMTSW-214-07-L-D-100-LA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| FTSH-105-01-F-D-RA | Samtec, Inc. | .050" X .050 TERMINAL STRIP | FTSH | -55°C ~ 125°C | - | - | 3.4A per Contact | Tube | Through Hole, Right Angle | - | - | |
| 850-80-021-30-001101 | Preci-Dip | CONN HDR 21POS 1.27MM SMD | 850 | -55°C ~ 125°C | - | - | 1A | Bulk | Surface Mount | - | - | |
| 95278-102A10 | Amphenol FCI | BERGSTIK HDR SMT | BERGSTIK® | - | - | Pick and Place | - | Tape & Reel (TR) | Surface Mount | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.