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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 929648-04-02-EU | 3M | CONN HEADER 2POS R/A .100" GOLD | 929 | -40°C ~ 105°C | - | - | 2.5A | Bulk | Through Hole, Right Angle | - | - | |
| FTMH-110-03-F-DV-A-P | Samtec, Inc. | 1MM MICRO TERMINAL STRIPS | FTMH | -55°C ~ 125°C | - | Board Guide, Pick and Place | 2.8A per Contact | Tube | Surface Mount | - | - | |
| MTLW-108-24-S-S-280 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| MTSW-106-08-L-D-210-RA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| MTSW-140-07-G-S-220 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| TFML-115-02-SM-D-A-K | Samtec, Inc. | .050 SHROUDED TERMINAL | Tiger Eye™ TFML | -55°C ~ 125°C | - | Board Guide, Pick and Place | - | Tube | Surface Mount | - | - | |
| 929647-07-05-I | 3M | CONN HEADER .100 SNGL STR 5POS | 929 | -40°C ~ 105°C | - | - | 2.5A | Bulk | Through Hole | - | - | |
| MTLW-103-23-G-S-250 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| HMTSW-126-27-L-Q-225 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| TMM-104-01-L-D-SM-P-TR | Samtec, Inc. | 2MM TERMINAL STRIP | TMM | -55°C ~ 125°C | - | Pick and Place | 3.2A per Contact | Cut Tape (CT) | Surface Mount | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.