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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 173081-7 | Agastat Relays / TE Connectivity | EI POST HDR 7P ASSY GOLD PLATE | EI | -20°C ~ 95°C | - | - | Varies by Wire Gauge | Bulk | Through Hole | - | - | |
| MTMM-134-11-S-D-515 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| 929647-01-32-EU | 3M | CONN HEADER .100" SNGL STR 32POS | 929 | -40°C ~ 105°C | - | - | 2.5A | Bulk | Through Hole | - | - | |
| TSM-108-01-TM-DH-K | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 105°C | - | Pick and Place | - | Tube | Surface Mount, Right Angle | - | RoHS Compliant | |
| HMTSW-116-09-G-Q-225 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| MTSW-222-11-S-Q-200-RA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 832-80-020-30-001191 | Preci-Dip | CONN HDR 20POS 2MM SMD | 832 | -55°C ~ 125°C | - | Pick and Place | 3A | Bulk | Surface Mount | - | - | |
| FTS-116-04-L-DV-P-TR | Samtec, Inc. | .050 X .050 C.L. LOW PROFILE TER | FTS | -55°C ~ 125°C | - | Pick and Place | 3.4A per Contact | Tape & Reel (TR) | Surface Mount | - | - | |
| MTSW-104-08-T-S-195 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| MTSW-102-24-S-S-230 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.