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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HMTSW-105-24-SM-D-230-002 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| MTSW-114-07-T-S-240 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 09185647322 | HARTING | CONN HEADER 64POS T/H | SEK | -55°C ~ 125°C | - | Keying Slot | - | Bulk | Through Hole | - | - | |
| MTSW-138-07-F-S-150 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 77311-115-36LF | Amphenol FCI | BERGSTIK | BERGSTIK® | - | - | - | - | Bulk | Through Hole | - | - | |
| HMTSW-116-09-G-D-004-RA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole, Right Angle | - | - | |
| MTLW-140-08-T-S-250 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| 1761606-7 | Agastat Relays / TE Connectivity | CONN HEADER LOPRO STR .100 20POS | AMP-Latch | -65°C ~ 105°C | - | Keying Slot | 1A per Contact | Tube | Through Hole | - | - | |
| FTS-104-03-LM-D-P | Samtec, Inc. | .050 X .050 C.L. LOW PROFILE TER | FTS | -55°C ~ 125°C | - | Pick and Place | 3.4A per Contact | Tube | Through Hole | - | - | |
| 10075025-F01-18ULF | Amphenol FCI | MINITEK SHRD HDR VERT | Minitek® | - | - | Keying Slot | 2A (AC/DC) | Tube | Through Hole | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.