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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TSM-110-05-SM-DV | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | - | - | Tube | Surface Mount | - | RoHS Compliant | |
| TMM-124-01-TM-S-RA-017 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| 72454-010 | Amphenol FCI | CONNECTOR BERGSTIK II/S-SMT/RR | Quickie™ | -65°C ~ 105°C | - | Keying Slot, Pick and Place | 1A | Tray | Surface Mount | - | - | |
| TSS-112-02-T-D | Samtec, Inc. | LOW PROFILE .025 SQ STRIPS | Flex Stack, TSS | -55°C ~ 105°C | - | Keying Slot | - | Tube | Through Hole | - | - | |
| MTSW-125-08-G-D-340 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| MTMM-126-08-T-D-225 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| DF13C-7P-1.25V(20) | 4D Systems | CONN HEADER 7POS 1.25MM SMD TIN | DF13 | -35°C ~ 85°C | - | Solder Retention | 1A | Tube | Surface Mount | - | - | |
| 87837-122HLF | Amphenol FCI | BERGSTIK II DR STRAIGHT RET | BERGSTIK® II | - | - | - | - | Bulk | Through Hole | - | - | |
| 0026482042 | Affinity Medical Technologies - a Molex company | CONN HEADER 4POS .156 R/A GOLD | KK 41662 | - | - | - | - | Bulk | Through Hole, Right Angle | - | - | |
| 0713085418 | Affinity Medical Technologies - a Molex company | CONN HEADER BKWY SMD TIN 18POS | C-Grid 71308 | - | - | - | - | Tube | Surface Mount | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.