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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 804-V3-087-6B-002101 | Preci-Dip | CONN HDR 87POS 0.100 PRESS FIT | 802 | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| MTSW-103-09-L-S-492 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| MTSW-126-07-F-D-130 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| MTLW-110-05-G-D-010 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| HMTSW-141-28-G-Q-730 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| MTSW-217-07-G-D-240 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| DF13C-12P-1.25V(50) | 4D Systems | CONN HEADER 12POS 1.25MM SMD AU | DF13 | -35°C ~ 85°C | - | Solder Retention | 1A | Tube | Surface Mount | - | - | |
| 86130342314385E1LF | Amphenol FCI | CONN HDR VERT 34POS .100" | Quickie™ | -55°C ~ 125°C | - | Keying Slot | - | Tray | Through Hole | - | - | |
| 0879112611 | Affinity Medical Technologies - a Molex company | C-GRID DRSW RA T/H HDR. 26CKT | C-Grid 87911 | - | - | - | - | Tube | Through Hole, Right Angle | - | - | |
| TFM-140-13-S-D-A | Samtec, Inc. | .050 X .050 MICRO STRIPS | Tiger Eye™ TFM | -55°C ~ 125°C | - | Board Guide | 2.9A per Contact | Tube | Through Hole | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.