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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 450-90-222-00-006000 | Mill-Max | CONN HDR DBL SOLDRTL | 450 | - | - | - | - | Bulk | Through Hole | - | RoHS non-compliant | |
| MTSW-127-12-S-T-730 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| MTLW-107-07-G-D-236 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| 0438100110 | Affinity Medical Technologies - a Molex company | MF SMC RA HDR W/CLIP 30 SAU | Mini-Fit BMI SMC 43810 | - | - | Board Lock | - | Tray | Through Hole, Right Angle | - | - | |
| MTSW-136-08-L-D-325 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| TFM-110-01-S-D-A-P | Samtec, Inc. | .050 X .050 MICRO STRIPS | Tiger Eye™ TFM | -55°C ~ 125°C | - | Board Guide, Pick and Place | 2.9A per Contact | Tube | Through Hole | - | - | |
| DF22R-2P-7.92DS | 4D Systems | CONN HEADER 2POS 7.92MM R/A TIN | EnerBee™ DF22 | -35°C ~ 85°C | - | Board Guide | 25A | Bulk | Through Hole, Right Angle | - | - | |
| 850-40-048-20-001000 | Mill-Max | CONN HDR SNG RA | 850 | - | - | - | - | Bulk | Through Hole, Right Angle | - | RoHS Compliant | |
| 69157-272HLF | Amphenol FCI | BERGSTIK II .100" DR STRAIGHT | BERGSTIK® II | - | - | - | - | Bulk | Through Hole | - | - | |
| MTSW-134-22-T-Q-225 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.