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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TMM-114-01-SM-S-RA-011 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| TFC-135-01-F-D | Samtec, Inc. | .050 X .050 TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| 5019530505 | Affinity Medical Technologies - a Molex company | 1.0 WB 1ROW RA WAFER ASSY AU PLT | Pico-Clasp 501953 | -40°C ~ 105°C | - | Solder Retention | Varies by Wire Gauge | Tape & Reel (TR) | Surface Mount, Right Angle | - | - | |
| MTSW-105-22-G-S-305-RA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 87348-6 | Agastat Relays / TE Connectivity | CONN HEADER .100 6POS VERT TIN | AMPMODU Mod II | - | - | - | - | Bulk | Through Hole | - | - | |
| TSS-122-05-L-D-RA | Samtec, Inc. | LOW PROFILE .025 SQ STRIPS | Flex Stack, TSS | -55°C ~ 125°C | - | Keying Slot | - | Tube | Through Hole, Right Angle | - | - | |
| 350-80-116-00-006101 | Preci-Dip | CONN HDR 16POS T/H 0.100 TIN | 350 | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| MTSW-212-09-S-T-430-RA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| MTLW-110-06-S-D-160 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| TFM-145-11-SM-D | Samtec, Inc. | .050 X .050 MICRO STRIPS | Tiger Eye™ TFM | -55°C ~ 125°C | - | - | 2.9A per Contact | Tube | Through Hole | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.