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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HTSS-110-04-L-D-RA | Samtec, Inc. | HIGH TEMP SHROUDED .100 TERMINAL | - | - | - | - | - | - | - | - | - | |
| T1M-03-F-SV-L-P | Samtec, Inc. | T1M 1MM TERMINAL STRIP | T1M | -55°C ~ 85°C | - | Pick and Place | 3.3A per Contact | Tube | Surface Mount | - | - | |
| MTMM-104-13-F-D-515 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| HMTSW-221-22-G-T-100-RA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole, Right Angle | - | - | |
| MTSW-105-07-G-S-100 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| MTLW-128-07-G-D-270 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| 0022283216 | Affinity Medical Technologies - a Molex company | KK 100 HDR POL VERT BWR 21POS | KK 42225 | - | - | - | - | Bulk | Through Hole | - | - | |
| MTSW-134-21-T-D-730 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 0713085192 | Affinity Medical Technologies - a Molex company | CONN HEADER BKWY SMD GOLD 92POS | C-Grid 71308 | - | - | Board Guide | - | Tube | Surface Mount | - | - | |
| 3-1761606-3 | Agastat Relays / TE Connectivity | CONN HEADER PIN 40POS VERT GOLD | AMP-Latch | -65°C ~ 105°C | - | Keying Slot | 1A per Contact | Tube | Through Hole | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.