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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 0469990016 | Affinity Medical Technologies - a Molex company | MINIFIT JR RA DRPEG V0 8CKT BLK | Mini-Fit Jr 5569 | - | - | Board Lock | - | Tray | Through Hole, Right Angle | - | - | |
| 2-794630-0 | Agastat Relays / TE Connectivity | CONN HEADER 3MM 20POS DUAL TIN | Micro MATE-N-LOK | -40°C ~ 105°C | - | - | Varies by Wire Gauge | Tray | Through Hole | - | - | |
| MTSW-117-21-G-D-1240-LL | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 78951-172HLF | Amphenol FCI | BERGSTIK II SR RIGHT ANGLE | BERGSTIK® II | - | - | - | - | Bulk | Through Hole, Right Angle | - | - | |
| M80-9272222 | Harwin | CONN | Datamate L-Tek | -55°C ~ 125°C | - | - | 2.2A | Tube | Surface Mount | - | - | |
| MTLW-110-07-L-D-230 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| TMMH-108-01-L-DV-A | Samtec, Inc. | 2MM LOW PROFILE STRIPS | - | - | - | - | - | - | - | - | - | |
| M80-5434222 | Harwin | 21+21 WAY M HORIZ BM SMT | Datamate J-Tek | -55°C ~ 125°C | - | Keying Slot, Mating Flange, Mounting Flange, Mounting Hardware | 2.2A | Tube | Surface Mount, Right Angle | - | - | |
| 351-10-118-00-011000 | Mill-Max | CONN HDR PIN | 351 | - | - | - | - | Bulk | Through Hole | - | RoHS Compliant | |
| MTSW-126-10-S-Q-100 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.