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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MMT-104-01-L-DH-001-K-TR | Samtec, Inc. | 2MM SMT STRIPS | - | - | - | - | - | Tape & Reel (TR) | - | - | - | |
| 1-103169-6 | Agastat Relays / TE Connectivity | CONN HEADER 36POS DUAL STR .100 | AMPMODU Mod II | -65°C ~ 105°C | - | - | 3A | Tray | Through Hole | - | - | |
| TMMH-110-01-G-D-EP-MW | Samtec, Inc. | 2MM LOW PROFILE STRIPS | - | - | - | - | - | - | - | - | - | |
| MTSW-110-13-T-D-430-RA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 1440400000 | Weidmuller | RSV 1.6 LS 4 GR 3.2 AU | Omnimate RSV | 100°C | IP20 | - | 10A | Bulk | Through Hole | - | - | |
| TSS-106-02-S-S | Samtec, Inc. | LOW PROFILE .025 SQ STRIPS | Flex Stack, TSS | -55°C ~ 125°C | - | Keying Slot | - | Tube | Through Hole | - | - | |
| 2340-6111TG | 3M | CONN HEADER 40POS SGL STR GOLD | 2300 | -55°C ~ 105°C | - | - | 3A | Bulk | Through Hole | - | - | |
| HMTSW-214-13-G-D-225-LA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| HMTSW-132-21-L-Q-200 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| TSM-120-03-L-DV-A-TR | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | Board Guide | - | Tape & Reel (TR) | Surface Mount | - | RoHS Compliant |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.