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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1-146806-3 | Agastat Relays / TE Connectivity | 09/10 MODII HDR DRST SFMT B/A | AMPMODU Mod II | -65°C ~ 105°C | - | - | - | Bulk | Surface Mount | - | - | |
| MTMM-104-04-L-D-157 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| MTSW-139-07-F-S-210 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| MMT-134-02-S-MT | Samtec, Inc. | 2MM SMT STRIPS | - | - | - | - | - | - | - | - | - | |
| 149012-3 | Agastat Relays / TE Connectivity | CONN HEADER 80POS VERT 30GOLD | Micro-Strip | -65°C ~ 125°C | - | Ground Bus (Plane) | Varies by Wire Gauge | Tray | Through Hole | - | - | |
| HMTSW-140-13-L-Q-730 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| TFM-105-02-S-D-SN | Samtec, Inc. | .050 X .050 MICRO STRIPS | Tiger Eye™ TFM | -55°C ~ 125°C | - | Solder Retention | 2.9A per Contact | Tube | Surface Mount | - | - | |
| 3793-5002UG | 3M | CONN HEADER 10POS R/A NO LATCH | 3000 | -55°C ~ 105°C | - | Keying Slot, Mounting Flange | 1.75A | Bulk | Through Hole, Right Angle | - | - | |
| MTSW-125-08-G-D-400 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 929710-11-13 | 3M | CONN HEADER 26PS STR DL .100 TIN | 929 | -40°C ~ 105°C | - | - | 2.5A | Bulk | Through Hole | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.