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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MTSW-136-13-S-D-950 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| MTLW-110-06-G-D-140 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| 89540-404HLF | Amphenol FCI | HEADER BERGSTIK | BERGSTIK® II | - | - | - | - | Bulk | Through Hole | - | - | |
| 450-V3-226-00-006101 | Preci-Dip | CONN HDR 26POS 2.54MM T/H | 450 | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| TLW-113-06-S-D | Samtec, Inc. | LOW PROFILE .025 SQ STRIPS | - | - | - | - | - | - | - | - | - | |
| EJH-108-01-F-D-SM-03-K-TR | Samtec, Inc. | .100 X .100 EJECTOR HEADER ASSEM | EJH | -55°C ~ 125°C | - | Keying Slot, Pick and Place | 3A | Tape & Reel (TR) | Surface Mount | - | - | |
| HMTSW-104-06-L-D-006 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| DF19L-30P-1H(54) | 4D Systems | CONN HEADER 30POS 1MM R/A SMD AU | DF19 | -35°C ~ 85°C | - | Solder Retention | - | Tape & Reel (TR) | Board Edge, Cutout; Surface Mount, Right Angle | - | - | |
| IPL1-105-03-L-SH-K | Samtec, Inc. | .100 TERMINAL ASSEMBLY | - | - | - | - | - | - | - | - | - | |
| M80-8393442 | Harwin | CONN HDR 2MM R/A W/LATCH 34POS | Datamate L-Tek | -55°C ~ 125°C | - | Strain Relief Clips | 2.2A | Tube | Through Hole, Right Angle | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.