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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 3-1969574-8 | Agastat Relays / TE Connectivity | ASSY,HDR,RIGHT ANGLE,GWT,DUAL RO | Economy Power 2.5 | -55°C ~ 105°C | - | Board Lock, Glow Wire Compliant | 4.2A | Bulk | Through Hole, Right Angle | - | - | |
| TSW-104-08-G-S-RA | Samtec, Inc. | CONN HEADER 4POS .100 SGL R/A AU | TSW | -55°C ~ 125°C | - | - | - | Bulk | Through Hole, Right Angle | - | - | |
| 54102-G08-00 | Amphenol FCI | BERGSTRIP 0.100" HEADER | BERGSTIK® | - | - | - | - | Tape & Reel (TR) | Through Hole | - | - | |
| 57202-G52-17ULF | Amphenol FCI | MINITEK | Minitek® | - | - | - | 2A (AC/DC) | Tube | Surface Mount | - | - | |
| EJH-120-01-F-D-SM-32-K-TR | Samtec, Inc. | .100 X .100 EJECTOR HEADER ASSEM | EJH | -55°C ~ 125°C | - | Keying Slot, Pick and Place | 3A | Tape & Reel (TR) | Surface Mount | - | - | |
| MTLW-140-07-L-S-210 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| TLW-117-05-H-S | Samtec, Inc. | LOW PROFILE .025 SQ STRIPS | - | - | - | - | - | - | - | - | - | |
| 350-40-122-00-107000 | Mill-Max | CONN HDR PIN | 350 | - | - | - | - | Bulk | Surface Mount | - | RoHS Compliant | |
| 830-80-018-20-001101 | Preci-Dip | CONN HDR 18POS 2MM T/H R/A | 830 | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole, Right Angle | - | - | |
| MTLW-113-22-T-D-000 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.