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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1722861107 | Affinity Medical Technologies - a Molex company | ULTRAFIT VERT TIN PLATED BLK | Ultra-Fit 172286 | -40°C ~ 105°C | - | Board Guide | - | Tray | Through Hole | - | - | |
| 09185147973 | HARTING | SEK/IDC ANGLED MALE, 2.9MM TAILS | - | - | - | - | - | - | - | - | - | |
| 3-174821-6 | Agastat Relays / TE Connectivity | CONN HEADR 0.049" 6POS SMT TIN | Fine Pitch | -30°C ~ 105°C | - | Board Guide | 0.5A | Bulk | Surface Mount | - | - | |
| MTMM-150-02-F-S-006 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| KLG.H22.LLA1G | LEMO | CONN PNL MNT RCPT 22PIN CRIMP | K | -20°C ~ 125°C | - | Mating Guide | 4A | Bulk | Through Hole | - | - | |
| PEC13SBCN | Sullins Connector Solutions | CONN HEADER .100 SINGL R/A 13POS | - | -65°C ~ 125°C | - | - | 3A | Bulk | Through Hole, Right Angle | - | - | |
| 0436500700 | Affinity Medical Technologies - a Molex company | CONN HEADER 7POS 3MM RT ANG TIN | Micro-Fit 3.0 43650 | - | - | Board Lock | - | Tray | Through Hole, Right Angle | - | - | |
| TSW-109-18-G-D | Samtec, Inc. | .025" SQ. TERMINAL STRIPS | TSW | -55°C ~ 125°C | - | - | - | Bulk | Through Hole | - | - | |
| MTLW-140-07-G-S-118 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| MTSW-109-28-G-D-200 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.