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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TST-105-03-L-D-LL | Samtec, Inc. | SHOUDED .025 SQ STRIPS | - | - | - | - | - | - | - | - | - | |
| 0022281107 | Affinity Medical Technologies - a Molex company | KK 100 HDR FRLK BWR RTAN 10POS | KK 42228 | - | - | - | - | Bulk | Through Hole, Right Angle | - | - | |
| 929450-01-12-I | 3M | CONN HEADER .100 SNGL STR 12POS | 929 | -40°C ~ 105°C | - | - | 2.5A | Bulk | Through Hole | - | - | |
| HMTSW-116-21-G-D-225 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| TMM-146-01-S-D-RE | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| 0430450419 | Affinity Medical Technologies - a Molex company | CONN HEADER 4POS 3MM STR SMD AU | Micro-Fit 3.0 43045 | - | - | Solder Retention | - | Tape & Reel (TR) | Surface Mount | - | - | |
| MTLW-125-07-S-D-240 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| TSM-117-05-S-DV | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | - | - | Tube | Surface Mount | - | RoHS Compliant | |
| 2-794630-4 | Agastat Relays / TE Connectivity | CONN HEADER 3MM 24POS DUAL TIN | Micro MATE-N-LOK | -40°C ~ 105°C | - | - | Varies by Wire Gauge | Tray | Through Hole | - | - | |
| MTMM-115-07-S-D-250 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.