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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MTSW-108-10-F-D-380 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 0702465004 | Affinity Medical Technologies - a Molex company | 2.54MM CGRID HDR SHRD /SLT | C-Grid 70246 | - | - | Keying Slot | - | Tray | Through Hole | - | - | |
| A1-20PA-2.54DS(71) | 4D Systems | HDR RA 20 POS 2.54MM | A1 | -55°C ~ 85°C | - | - | 3A | Bulk | Through Hole, Right Angle | - | - | |
| TSM-117-04-T-SH-A | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 105°C | - | Board Guide | - | Tube | Surface Mount, Right Angle | - | RoHS Compliant | |
| MTLW-118-05-G-D-110 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| 151206-7422-RB | 3M | CONN HEADER 2MM 6POS DL R/A GOLD | 1512 | -55°C ~ 105°C | - | - | 1A | Bulk | Through Hole, Right Angle | - | - | |
| MTMM-108-07-G-Q-005-002 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| 86836-134HLF | Amphenol FCI | HEADER BERGSTIK | BERGSTIK® II | - | - | - | - | Bulk | Through Hole | - | - | |
| 5-104178-6 | Agastat Relays / TE Connectivity | CONN HEADER .050 10POS VERT T/H | AMPMODU System 50 | -65°C ~ 105°C | - | - | - | Tube | Through Hole | - | - | |
| 70246-6021 | Affinity Medical Technologies - a Molex company | CONN HEADER 60POS .100 VERT GOLD | C-Grid 70246 | - | - | Keying Slot | - | Tray | Through Hole | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.