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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TMM-149-01-S-S-RA-048 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| MTLW-101-06-T-S-001 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| TSS-111-01-G-S | Samtec, Inc. | LOW PROFILE .025 SQ STRIPS | Flex Stack, TSS | -55°C ~ 125°C | - | Keying Slot | - | Tube | Through Hole | - | - | |
| TST-107-01-T-D-11 | Samtec, Inc. | SHOUDED .025 SQ STRIPS | - | - | - | - | - | - | - | - | - | |
| TMM-107-06-G-D-SM-A-TR | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | Tape & Reel (TR) | - | - | - | |
| TSM-104-02-T-SH-K | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 105°C | - | Pick and Place | - | Tube | Surface Mount, Right Angle | - | RoHS Compliant | |
| 1-1586863-4 | Agastat Relays / TE Connectivity | CONN HEADER 14POS R/A DL TIN | VAL-U-LOK | -40°C ~ 105°C | - | Glow Wire Compliant | 9A | Tray | Through Hole, Right Angle | - | - | |
| TSM-118-05-SM-DV | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | - | - | Tube | Surface Mount | - | RoHS Compliant | |
| 2029266-3 | Agastat Relays / TE Connectivity | 3P MICRO MNL HDR SR 30AU LP BL | Micro MATE-N-LOK | -40°C ~ 105°C | - | Solder Retention | Varies by Wire Gauge | Bulk | Surface Mount, Right Angle | - | - | |
| TMM-105-01-S-Q | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.