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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MTMM-125-14-G-D-375 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| 1-172681-0 | Agastat Relays / TE Connectivity | CONN HEADER 10POS VERT 2.5MM | AMP-ULTREX | -30°C ~ 105°C | - | - | 2A | Tray | Through Hole | - | - | |
| 78286-116HLF | Amphenol FCI | HEADER BERGSTIK | BERGSTIK® II | - | - | - | - | Bulk | Through Hole | - | - | |
| SWR120-NPEG-S05-HM-BG | Sullins Connector Solutions | CONN HDR 1.25MM TIN 5POS SMD R/A | SWR120 | -25°C ~ 85°C | - | Solder Retention | 1A | Bulk | Surface Mount, Right Angle | - | - | |
| MTLW-106-08-G-S-430 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| TSM-102-01-SS-SH | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | - | - | Tube | Surface Mount, Right Angle | - | RoHS Compliant | |
| 5011902017 | Affinity Medical Technologies - a Molex company | CONN HEADER 1MM 20POS SMD GOLD | Pico-Clasp 501190 | - | - | Pick and Place, Solder Retention | - | Cut Tape (CT) | Surface Mount | - | - | |
| MTMM-125-02-F-Q-006 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| TFM-127-01-S-S | Samtec, Inc. | .050 X .050 MICRO STRIPS | Tiger Eye™ TFM | -55°C ~ 125°C | - | - | 2.9A per Contact | Tube | Through Hole | - | - | |
| MTMM-106-11-G-D-460 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.