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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HMTSW-212-10-G-T-225-LA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| MMT-110-02-LM-SH-A-P | Samtec, Inc. | 2MM SMT STRIPS | - | - | - | - | - | - | - | - | - | |
| 0022112172 | Affinity Medical Technologies - a Molex company | KK 100 HDR FRLK VERT 17POS GOLD | KK 6373 | - | - | - | - | Bulk | Through Hole | - | - | |
| HMTSW-221-08-L-Q-200-LA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| 961216-6300-AR-PR | 3M | CONN HEADER VERT 16POS GOLD SMD | 961 | -25°C ~ 105°C | - | Pick and Place | 2A | Tape & Reel (TR) | Surface Mount | - | - | |
| MTSW-150-06-G-D-120 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| TSM-114-01-F-DV-P | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | Pick and Place | - | Tube | Surface Mount | - | RoHS Compliant | |
| 10072354-F01-20ULF | Amphenol FCI | MINITEK SHRD HDR RA | Minitek® | - | - | Keying Slot | 2A (AC/DC) | Tube | Through Hole, Right Angle | - | - | |
| 450-40-242-00-001000 | Mill-Max | CONN HDR DBL SOLDRTL | 450 | - | - | - | - | Bulk | Through Hole | - | RoHS Compliant | |
| IPT1-116-01-SM-D-RA | Samtec, Inc. | .100 DOUBLE ROW SHROUDED TERMINA | - | - | - | - | - | - | - | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.