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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MTSW-130-12-L-Q-430 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| TSW-128-17-G-S | Samtec, Inc. | CONN HEADER 28POS .100" SGL GOLD | TSW | -55°C ~ 125°C | - | - | - | Bulk | Through Hole | - | - | |
| TSM-146-02-LM-DV | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | - | - | Tube | Surface Mount | - | RoHS Compliant | |
| MTLW-120-09-G-D-280 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| TSM-104-01-S-DV-A | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | Board Guide | - | Tube | Surface Mount | - | RoHS Compliant | |
| TFM-125-01-FM-D-RA | Samtec, Inc. | .050 X .050 MICRO STRIPS | Tiger Eye™ TFM | -55°C ~ 125°C | - | - | 2.9A per Contact | Tube | Through Hole, Right Angle | - | - | |
| MTLW-129-07-F-D-255 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| 1-173081-0 | Agastat Relays / TE Connectivity | CONN HEADER 10POS GOLD NATURL | EI | -20°C ~ 95°C | - | - | Varies by Wire Gauge | Bulk | Through Hole | - | - | |
| TSW-141-08-L-S | Samtec, Inc. | CONN HEADER 41POS .100" SGL GOLD | TSW | -55°C ~ 125°C | - | - | - | Bulk | Through Hole | - | - | |
| EHT-120-01-S-D-SM-LC-35-K | Samtec, Inc. | 2MM EJECTOR HEADER | EHT | -55°C ~ 125°C | - | Board Lock, Keying Slot, Pick and Place | 3A | Tube | Surface Mount | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.