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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TFC-140-32-F-D-K-TR | Samtec, Inc. | .050 X .050 TERMINAL STRIP | - | - | - | - | - | Tape & Reel (TR) | - | - | - | |
| MTLW-116-07-G-D-278 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| MTLW-106-07-T-S-100 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| TMM-140-01-F-D-RA-028 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| MMT-117-02-F-DH-K-TR | Samtec, Inc. | 2MM SMT STRIPS | - | - | - | - | - | Tape & Reel (TR) | - | - | - | |
| HMTSW-107-24-L-D-329 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| 2011731208 | Affinity Medical Technologies - a Molex company | SLIM-GRID HEADER, 8 CIRCUITS, SU | Slim-Grid 201173 | -55°C ~ 105°C | - | Pick and Place | - | Tube | Surface Mount, Right Angle | - | - | |
| FTS-110-02-F-D | Samtec, Inc. | .050 X .050 C.L. LOW PROFILE TER | FTS | -55°C ~ 125°C | - | - | 3.4A per Contact | Tube | Through Hole | - | - | |
| 892-18-068-10-004101 | Preci-Dip | CONN HDR 68POS 2.54MM T/H | 892 | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| TFM-115-02-S-S-A-K | Samtec, Inc. | .050 X .050 MICRO STRIPS | Tiger Eye™ TFM | -55°C ~ 125°C | - | Board Guide, Pick and Place | 2.9A per Contact | Tube | Surface Mount | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.