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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 0022288030 | Affinity Medical Technologies - a Molex company | CONN HEADER 3POS .100 R/A TIN | KK 42377 | - | - | - | - | Bulk | Through Hole, Right Angle | - | - | |
| FTM-135-02-L-DV-P-TR | Samtec, Inc. | 1MM MICRO STRIPS | FTM | -55°C ~ 125°C | - | Pick and Place | 2.8A per Contact | Tape & Reel (TR) | Surface Mount | - | - | |
| STMM-110-01-F-D-SM | Samtec, Inc. | 2MM TERMINAL STRIPS | - | - | - | - | - | - | - | - | - | |
| 79243-450HLF | Amphenol FCI | HEADER BERGSTIK | BERGSTIK® II | - | - | - | - | Bulk | Through Hole | - | - | |
| 350-10-109-00-018101 | Preci-Dip | CONN HDR 9POS T/H 0.100 GOLD | 350 | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| TSM-104-02-S-DH-005 | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | - | - | Tube | Surface Mount, Right Angle | - | RoHS Compliant | |
| HMTSW-132-13-L-Q-100 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 125°C | - | - | 3A | Bulk | Through Hole | - | - | |
| BDL-132-G-F | Samtec, Inc. | INTERCONNECT STRIPS | BDL | -55°C ~ 125°C | - | - | - | Tube | Through Hole | - | - | |
| TMM-105-01-L-S-RA-001 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| 951108-4620-AR-PR | 3M | CONN HEADER 8POS 2MM R/A SMD | 951 | -25°C ~ 105°C | - | Pick and Place | 1A | Tape & Reel (TR) | Surface Mount, Right Angle | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.