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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 0015910447 | Affinity Medical Technologies - a Molex company | CONN HEADER 44POS GOLD SMD | C-Grid 71308 | - | - | Board Guide | - | Tube | Surface Mount | - | - | |
| MTLW-140-08-G-S-360 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| 2-2029155-0 | Agastat Relays / TE Connectivity | 20P R/A HDR VAL-U-LOK V2 BLK | VAL-U-LOK | -40°C ~ 105°C | - | - | - | Bulk | Through Hole, Right Angle | - | - | |
| EJH-115-01-F-D-SM-13-P | Samtec, Inc. | .100 X .100 EJECTOR HEADER ASSEM | EJH | -55°C ~ 125°C | - | Keying Slot, Pick and Place | 3A | Tube | Surface Mount | - | - | |
| TSM-107-02-S-DV-014 | Samtec, Inc. | .025 SQ. TERMINAL STRIPS | TSM | -55°C ~ 125°C | - | - | - | Tube | Surface Mount | - | RoHS Compliant | |
| MTSW-103-06-T-S-145 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| 68023-430HLF | Amphenol FCI | HEADER BERGSTIK | BERGSTIK® II | - | - | - | - | Bulk | Through Hole, Right Angle | - | - | |
| 77316-140LF | Amphenol FCI | BERGSTIK | BERGSTIK® | - | - | - | - | Bulk | Through Hole, Right Angle | - | - | |
| MTMM-115-13-G-D-400 | Samtec, Inc. | 2MM TERMINAL STRIP | - | - | - | - | - | - | - | - | - | |
| 2132230-6 | Agastat Relays / TE Connectivity | CONN HEADER 6POS VERT 2.5MM | Economy Power 2.5 | -55°C ~ 105°C | - | Board Guide | 4.2A | Bulk | Through Hole | - | - |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.