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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MTSW-202-07-T-D-130-LA | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | - | - | - | - | - | - | - | - | - | |
| TFM-140-32-L-D-A-K-TR | Samtec, Inc. | .050 X .050 MICRO STRIPS | Tiger Eye™ TFM | -55°C ~ 125°C | - | Board Guide, Pick and Place | 2.9A per Contact | Tape & Reel (TR) | Surface Mount | - | - | |
| MTLW-136-08-L-D-110 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| TMMH-131-04-T-DV-EP | Samtec, Inc. | 2MM LOW PROFILE STRIPS | - | - | - | - | - | - | - | - | - | |
| 830-80-004-30-001191 | Preci-Dip | CONN HDR 4POS 2MM SMD | 830 | -55°C ~ 125°C | - | Pick and Place | 3A | Bulk | Surface Mount | - | - | |
| MTLW-106-07-S-D-020 | Samtec, Inc. | MODIFIED LOW PROFILE TERMINAL | - | - | - | - | - | - | - | - | - | |
| HMTSW-105-08-T-D-200 | Samtec, Inc. | MODIFIED .025 SQUARE POST TERMIN | Flex Stack, HMTSW | -55°C ~ 105°C | - | - | 3A | Bulk | Through Hole | - | - | |
| 0705750086 | Affinity Medical Technologies - a Molex company | CONN HEADER R/A GOLD 17POS | SL 70575 | - | - | Board Guide | - | Tube | Through Hole, Right Angle | - | - | |
| 86453-308LF | Amphenol FCI | MINITEK II RA HDR | Minitek® | -40°C ~ 105°C | - | - | 2A (AC/DC) | Bulk | Through Hole, Right Angle | - | - | |
| 451-10-204-00-011000 | Mill-Max | CONN HDR DBL SOLDRTL | 451 | - | - | - | - | Bulk | Through Hole | - | RoHS Compliant |
Headers with male pins are fundamental components in rectangular connectors, serving as the mating interface for female sockets or receptacles. These male pins establish electrical connections when inserted into corresponding female connectors, facilitating signal and power transmission. Headers with male pins are commonly used in PCBs, control panels, and other electronic systems, offering a standardized and reliable solution for interconnecting devices and components.