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| Image | Part Number | Manufacturer | Description | Series | Packaging | RoHS Status | Manufacturer Part Number | Contact Finish | Contact Finish Thickness | Type | Pitch | Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 3434-0000T | 3M | CONN PCB 26 PIN .062" TIN | 3400 | Bulk | - | - | Tin-Lead | 200.0µin (5.08µm) | - | - | - | |
| 1-5111595-2 | Agastat Relays / TE Connectivity | 060 ASSY SYS 50 PADDLEBOARD | AMPMODU System 50 | Tray | - | - | Tin | 100.0µin (2.54µm) | - | - | - | |
| SIP110-PPEC-D13-SK-BK | Sullins Connector Solutions | CONN PLUG IDC .100" 26POS | - | Bulk | - | - | Tin | 100.0µin (2.54µm) | - | - | - | |
| CWR-142-60-0003 | CW Industries | CONN PCB 60PIN TIN | CWR | Bulk | - | - | Tin-Lead | 100.0µin (2.54µm) | - | - | - | |
| 0915771306 | Affinity Medical Technologies - a Molex company | PF LOPRO IDT B-IN INDT YEL 6POS | Picoflex PF-50 91577 | Tube | - | - | Tin | 78.7µin (2.00µm) | - | - | - | |
| 69830-040 | Amphenol FCI | CONN HEADER 40POS TIN PCB T/H | Quickie™ | Tube | - | - | Tin-Lead | 150.0µin (3.81µm) | - | - | - | |
| SIP110-PPEC-D10-ST-BK | Sullins Connector Solutions | CONN PLUG IDC .100" 20POS | - | Bulk | - | - | Tin | 100.0µin (2.54µm) | - | - | - | |
| AWLP 50/3,2-T | ASSMANN WSW Components | CONN DIP 50POS .1" X .1" TIN | - | Tray | - | - | Tin | - | - | - | - | |
| 0510150500 | Affinity Medical Technologies - a Molex company | CONN HOUSING BOARD-IN 5POS 2MM | 51015 | Bulk | - | - | - | - | - | - | - | |
| 09181249622 | HARTING | SEK-PBC SV MA 2R 24P SN - DESIGN | SEK | Bulk | - | - | - | - | - | - | - |
Board in, direct wire to board connectors play a crucial role in the electronics industry by providing a direct and secure connection between wires and printed circuit boards (PCBs). These connectors eliminate the need for additional wire termination methods, allowing for a streamlined and space-efficient integration of wires into electronic assemblies. They find applications in various devices where efficient wire-to-board connections are essential, enhancing the overall reliability and ease of assembly in electronic systems.