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| Image | Part Number | Manufacturer | Description | Series | Packaging | RoHS Status | Manufacturer Part Number | Contact Finish | Contact Finish Thickness | Type | Pitch | Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 69830-040LF | Amphenol FCI | CONN HEADER 40POS TIN PCB T/H | Quickie™ | Tube | - | - | Tin | 150.0µin (3.81µm) | - | - | - | |
| 1-5111595-1 | Agastat Relays / TE Connectivity | CONN IDC 50POS T/H TIN | AMPMODU System 50 | Tray | - | - | Tin | 100.0µin (2.54µm) | - | - | - | |
| 746610-4 | Agastat Relays / TE Connectivity | CONN PLUG IDC 20POS .1X.1 DIP | AMP-Latch | Bulk | - | - | Tin-Lead | 100.0µin (2.54µm) | - | - | - | |
| 1-2178713-0 | Agastat Relays / TE Connectivity | CONN 10P PBC VERT RCPT TH | Micro-MaTch | Tape & Reel (TR) | - | - | Tin | 118.1µin (3.00µm) | - | - | - | |
| DF4-4DP-2C | 4D Systems | CONN PLUG 4POS DOUBLE CRIMP | DF4 | Bulk | - | - | - | - | - | - | - | |
| 3-173985-1 | Agastat Relays / TE Connectivity | AMP CT MT AMP-IN HDR-V BLU 11P | CT Amp-In | Tray | - | - | Tin | - | - | - | - | |
| 2-216792-6 | Agastat Relays / TE Connectivity | AMP LATCH ASSY 26 PO | AMP-Latch | Tape & Reel (TR) | - | - | Tin | 118.1µin (3.00µm) | - | - | - | |
| 746612-2 | Agastat Relays / TE Connectivity | CONN PLUG 14POS DIP .1X.3 15GOLD | AMP-Latch | Tray | - | - | Gold | 15.0µin (0.38µm) | - | - | - | |
| 12DB-8M | JST | CONN IDC DB 12POS 2.5MM GRN PCB | DB | Bulk | - | - | Tin-Lead | - | - | - | - | |
| 02DB-4K(LF) | JST | CONN IDC DB 2POS 2.5MM BLK PCB | DB | Bulk | - | - | Tin-Lead | - | - | - | - |
Board in, direct wire to board connectors play a crucial role in the electronics industry by providing a direct and secure connection between wires and printed circuit boards (PCBs). These connectors eliminate the need for additional wire termination methods, allowing for a streamlined and space-efficient integration of wires into electronic assemblies. They find applications in various devices where efficient wire-to-board connections are essential, enhancing the overall reliability and ease of assembly in electronic systems.