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| Image | Part Number | Manufacturer | Description | Series | Packaging | RoHS Status | Manufacturer Part Number | Contact Finish | Contact Finish Thickness | Type | Pitch | Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2-1437006-4 | Agastat Relays / TE Connectivity | CONN PLUG 34POS DIP .100 | AMP-Latch | Bulk | - | - | Tin | 118.1µin (3.00µm) | - | - | - | |
| SIP110-PPJC-D17-ST-BK | Sullins Connector Solutions | CONN PLUG IDC .100" 34POS | - | Bulk | - | - | Gold | 15.0µin (0.38µm) | - | - | - | |
| SIP110-PPJC-D13-ST-BK | Sullins Connector Solutions | CONN PLUG IDC .100" 26POS | - | Bulk | - | - | Gold | 15.0µin (0.38µm) | - | - | - | |
| 3-173985-0 | Agastat Relays / TE Connectivity | CTAMP-INASSY10PVBLUE | CT Amp-In | Tray | - | - | Tin | - | - | - | - | |
| DF4-32DP-2C | 4D Systems | CONN PLUG 32POS DOUBLE CRIMP | DF4 | Bulk | - | - | - | - | - | - | - | |
| 22-43-2020 | Affinity Medical Technologies - a Molex company | CONN PLUG IDT 2POS 2.5MM PCB | SPOX 42254 | Tape & Reel (TR) | - | - | Tin | 100.0µin (2.54µm) | - | - | - | |
| M50-3802042 | Harwin | CONN DIP PLUG 40POS 1.27MM IDC | Archer M50 | Tray | - | - | Gold | - | - | - | - | |
| SIP110-PPKC-D07-ST-BK | Sullins Connector Solutions | CONN PLUG IDC .100" 14POS | - | Bulk | - | - | Gold | 15.0µin (0.38µm) | - | - | - | |
| 5-111039-2 | Agastat Relays / TE Connectivity | 26 PADDLEBOARD ASSY W/COVER | AMP-Latch | Tray | - | - | Tin | 100.0µin (2.54µm) | - | - | - | |
| 3422-0000T | 3M | CONN PCB 20 PIN .062" TIN | 3400 | Bulk | - | - | Tin-Lead | 200.0µin (5.08µm) | - | - | - |
Board in, direct wire to board connectors play a crucial role in the electronics industry by providing a direct and secure connection between wires and printed circuit boards (PCBs). These connectors eliminate the need for additional wire termination methods, allowing for a streamlined and space-efficient integration of wires into electronic assemblies. They find applications in various devices where efficient wire-to-board connections are essential, enhancing the overall reliability and ease of assembly in electronic systems.