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Rectangular Connectors - Board In, Direct Wire to Board
Rectangular Connectors - Board In, Direct Wire to Board
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- Connectors, Interconnects
- Rectangular Connectors - Board In, Direct Wire to Board
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| Image | Part Number | Manufacturer | Description | Series | Packaging | RoHS Status | Manufacturer Part Number | Contact Finish | Contact Finish Thickness | Type | Pitch | Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
0521470910 | Affinity Medical Technologies - a Molex company | 9CKT MINI WIRE TRAP CONN | 52147 | Tray | - | - | Tin | 35.4µin (0.90µm) | - | - | - |
|
2-5111595-0 | Agastat Relays / TE Connectivity | CONN IDC 28POS T/H TIN | AMPMODU System 50 | Tray | - | - | Tin | 100.0µin (2.54µm) | - | - | - |
|
HIF2B-26D-2.54RA | 4D Systems | CONN HOUSING 26POS 2.54MM | HIF2B | Bulk | - | - | Gold | - | - | - | - |
|
SIP110-PPPC-D12-SK-BK | Sullins Connector Solutions | CONN PLUG IDC .100" 24POS | - | Bulk | - | - | Gold | Flash | - | - | - |
|
68120-060LF | Amphenol FCI | CONN HEADER 60POS TIN PCB T/H | Quickie™ | Tube | - | - | Tin | 100.0µin (2.54µm) | - | - | - |
|
|
111360-1 | Agastat Relays / TE Connectivity | 10 PADDLEBOARD ASSY | AMP-Latch | Bulk | - | - | Tin-Lead | 100.0µin (2.54µm) | - | - | - |
|
|
111595-6 | Agastat Relays / TE Connectivity | 026 ASSY SYS 50 PADDLEBOARD | AMPMODU System 50 | Tray | - | - | Tin-Lead | 50.0µin (1.27µm) | - | - | - |
|
490107670412 | Wurth Electronics | REDFIT IDC SKEDD CONNECTOR | WR-WST | Tube | - | - | Gold | - | - | - | - |
|
|
69830-024LF | Amphenol FCI | CONN HEADER 24POS TIN PCB T/H | Quickie™ | Tube | - | - | Tin | 150.0µin (3.81µm) | - | - | - |
|
04DB-6S(LF) | JST | CONN IDC DB 4POS 2.5MM WHT PCB | DB | Bulk | - | - | Tin-Lead | - | - | - | - |
About Rectangular Connectors - Board In, Direct Wire to Board
Board in, direct wire to board connectors play a crucial role in the electronics industry by providing a direct and secure connection between wires and printed circuit boards (PCBs). These connectors eliminate the need for additional wire termination methods, allowing for a streamlined and space-efficient integration of wires into electronic assemblies. They find applications in various devices where efficient wire-to-board connections are essential, enhancing the overall reliability and ease of assembly in electronic systems.