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| Image | Part Number | Manufacturer | Description | Series | Packaging | RoHS Status | Manufacturer Part Number | Contact Finish | Contact Finish Thickness | Type | Pitch | Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 99460-0016T | 3M | CONN 60POS .1X.1 IDC RIBBON PCB | 994 | Bulk | - | - | Tin-Lead | 100.0µin (2.54µm) | - | - | - | |
| SIP110-PPKC-D04-ST-BK | Sullins Connector Solutions | CONN PLUG IDC .100" 8POS | - | Bulk | - | - | Gold | 15.0µin (0.38µm) | - | - | - | |
| 51022-0200 | Affinity Medical Technologies - a Molex company | CONN HOUSING 2POS 1.25MM | 51022 | Bulk | - | - | - | - | - | - | - | |
| 09181409622 | HARTING | SEK-PBC SV MA 2R 40P SN - DESIGN | SEK | Tray | - | - | - | - | - | - | - | |
| 111360-5 | Agastat Relays / TE Connectivity | 26 PADDLEBOARD ASSY | AMP-Latch | Bulk | - | - | Tin-Lead | 100.0µin (2.54µm) | - | - | - | |
| 90584-1316 | Affinity Medical Technologies - a Molex company | CONN RECEPT IDT 16POS 1.27MM TIN | Picoflex 90584 | Tube | - | - | Tin | 80.0µin (2.03µm) | - | - | - | |
| 111382-8 | Agastat Relays / TE Connectivity | CONN PLUG DIP 34POS .100 TIN IDC | AMP-Latch | Tube | - | - | Tin-Lead | 100.0µin (2.54µm) | - | - | - | |
| HIF2B-14-2.54RA | 4D Systems | CONN HOUSING 14POS 2.54MM | HIF2B | Bulk | - | - | Gold | - | - | - | - | |
| SIP110-PPJC-D12-SK-BK | Sullins Connector Solutions | CONN PLUG IDC .100" 24POS | - | Bulk | - | - | Gold | 15.0µin (0.38µm) | - | - | - | |
| 7840-0000T | 3M | CONN PCB 40POS .100 DL 2.8MM | 78XX | Tray | - | - | Tin | - | - | - | - |
Board in, direct wire to board connectors play a crucial role in the electronics industry by providing a direct and secure connection between wires and printed circuit boards (PCBs). These connectors eliminate the need for additional wire termination methods, allowing for a streamlined and space-efficient integration of wires into electronic assemblies. They find applications in various devices where efficient wire-to-board connections are essential, enhancing the overall reliability and ease of assembly in electronic systems.