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| Image | Part Number | Manufacturer | Description | Series | Packaging | RoHS Status | Manufacturer Part Number | Contact Finish | Contact Finish Thickness | Type | Pitch | Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SIP110-PPVC-D10-SK-BK | Sullins Connector Solutions | CONN PLUG IDC .100" 20POS | - | Bulk | - | - | Gold | Flash | - | - | - | |
| 7830-0000PR | 3M | 30/PCB/2ROW/2.8MM | 78XX | Bulk | - | - | Gold | Flash | - | - | - | |
| 2-216792-6 | Agastat Relays / TE Connectivity | AMP LATCH ASSY 26 PO | AMP-Latch | Tape & Reel (TR) | - | - | Tin | 118.1µin (3.00µm) | - | - | - | |
| 746612-2 | Agastat Relays / TE Connectivity | CONN PLUG 14POS DIP .1X.3 15GOLD | AMP-Latch | Tray | - | - | Gold | 15.0µin (0.38µm) | - | - | - | |
| 12DB-8M | JST | CONN IDC DB 12POS 2.5MM GRN PCB | DB | Bulk | - | - | Tin-Lead | - | - | - | - | |
| 1-111382-0 | Agastat Relays / TE Connectivity | CONN PLUG DIP 50 POS .100 IDC | AMP-Latch | Tube | - | - | Tin-Lead | 100.0µin (2.54µm) | - | - | - | |
| SIP110-PPPC-D10-ST-BK | Sullins Connector Solutions | CONN PLUG DIP IDC 20POS GOLD | SIP110 | Tray | - | - | Gold | Flash | - | - | - | |
| 1339308-1 | Agastat Relays / TE Connectivity | ASSY 4 PR SGL ENTRY PIVOT II | Pivot II | Tray | - | - | Tin | 150.0µin (3.81µm) | - | - | - | |
| 68120-016LF | Amphenol FCI | CONN HEADER 16POS TIN PCB T/H | Quickie™ | Tube | - | - | Tin | 100.0µin (2.54µm) | - | - | - | |
| CWR-130-40-0000 | CW Industries | CONNECTOR DIP 40 PIN GOLD IDC | CWR | Bulk | - | - | Gold | 10.0µin (0.25µm) | - | - | - |
Board in, direct wire to board connectors play a crucial role in the electronics industry by providing a direct and secure connection between wires and printed circuit boards (PCBs). These connectors eliminate the need for additional wire termination methods, allowing for a streamlined and space-efficient integration of wires into electronic assemblies. They find applications in various devices where efficient wire-to-board connections are essential, enhancing the overall reliability and ease of assembly in electronic systems.