Loading products…
| Image | Part Number | Manufacturer | Description | Series | Packaging | RoHS Status | Manufacturer Part Number | Contact Finish | Contact Finish Thickness | Type | Pitch | Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| AWLP-24/3.2-T-R | ASSMANN WSW Components | CONN DIP 24POS .1" X .1" TIN | - | Tray | - | - | Tin | - | - | - | - | |
| SIP110-PPPC-D04-SK-BK | Sullins Connector Solutions | CONN PLUG IDC .100" 8POS | - | Bulk | - | - | Gold | Flash | - | - | - | |
| DF4-8PA-2R26 | 4D Systems | CONN PLUG 8POS AWG26 R/ANGLE | DF4 | Bulk | - | - | Tin | - | - | - | - | |
| 111036-8 | Agastat Relays / TE Connectivity | 40 PADDLEBOARD ASSY W/COVER | AMP-Latch | Bulk | - | - | Tin-Lead | 100.0µin (2.54µm) | - | - | - | |
| HIF2EB3BA-16D-AA-50.0KB | 4D Systems | CONN | HIF2E | - | - | - | - | - | - | - | - | |
| 746611-6 | Agastat Relays / TE Connectivity | CONN PLUG 16 POS .100 AU DIP | AMP-Latch | Tray | - | - | Gold | 30.0µin (0.76µm) | - | - | - | |
| 3140-10-00 | CNC Tech | CONN DIP HDR IDC 10POS PCB | - | Tray | - | - | Gold | Flash | - | - | - | |
| 0905842320 | Affinity Medical Technologies - a Molex company | 1.27MM PF LOPRO IDT B-IN STKT | Picoflex 90584 | Tube | - | - | Tin | 80.0µin (2.03µm) | - | - | - | |
| 1339303-3 | Agastat Relays / TE Connectivity | ASSY 4 PR SGL ENTRY PIVOT II | Pivot II | Bulk | - | - | Tin | 150.0µin (3.81µm) | - | - | - | |
| 2-6437006-2 | Agastat Relays / TE Connectivity | CONN PLUG 34POS .100 PCB IDC | AMP-Latch | Tray | - | - | Tin | 100.0µin (2.54µm) | - | - | - |
Board in, direct wire to board connectors play a crucial role in the electronics industry by providing a direct and secure connection between wires and printed circuit boards (PCBs). These connectors eliminate the need for additional wire termination methods, allowing for a streamlined and space-efficient integration of wires into electronic assemblies. They find applications in various devices where efficient wire-to-board connections are essential, enhancing the overall reliability and ease of assembly in electronic systems.