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| Image | Part Number | Manufacturer | Description | Series | Packaging | RoHS Status | Manufacturer Part Number | Contact Finish | Contact Finish Thickness | Type | Pitch | Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 22-43-2080 | Affinity Medical Technologies - a Molex company | CONN PLUG IDT 8POS 2.5MM PCB | SPOX 42254 | Tape & Reel (TR) | - | - | Tin | 100.0µin (2.54µm) | - | - | - | |
| AWLP 10/3,2-G | ASSMANN WSW Components | CONN DIP 10POS .1" X .1" GOLD | - | Tray | - | - | Gold | - | - | - | - | |
| HIF2C-10DT-1.27R(01) | 4D Systems | CONN HOUSING 10POS 1.27MM | HIF2C | Bulk | - | - | Gold | - | - | - | - | |
| XG2A-6002 | Omron | CONN SOCKET IDC 60POS .1X.1 | XG2 | Bulk | - | - | Tin | - | - | - | - | |
| SIP110-PPVC-D03-SK-BK | Sullins Connector Solutions | CONN PLUG IDC .100" 6POS | - | Bulk | - | - | Gold | Flash | - | - | - | |
| 1-111382-0 | Agastat Relays / TE Connectivity | CONN PLUG DIP 50 POS .100 IDC | AMP-Latch | Tube | - | - | Tin-Lead | 100.0µin (2.54µm) | - | - | - | |
| SIP110-PPPC-D10-ST-BK | Sullins Connector Solutions | CONN PLUG DIP IDC 20POS GOLD | SIP110 | Tray | - | - | Gold | Flash | - | - | - | |
| 1339308-1 | Agastat Relays / TE Connectivity | ASSY 4 PR SGL ENTRY PIVOT II | Pivot II | Tray | - | - | Tin | 150.0µin (3.81µm) | - | - | - | |
| 68120-016LF | Amphenol FCI | CONN HEADER 16POS TIN PCB T/H | Quickie™ | Tube | - | - | Tin | 100.0µin (2.54µm) | - | - | - | |
| CWR-130-40-0000 | CW Industries | CONNECTOR DIP 40 PIN GOLD IDC | CWR | Bulk | - | - | Gold | 10.0µin (0.25µm) | - | - | - |
Board in, direct wire to board connectors play a crucial role in the electronics industry by providing a direct and secure connection between wires and printed circuit boards (PCBs). These connectors eliminate the need for additional wire termination methods, allowing for a streamlined and space-efficient integration of wires into electronic assemblies. They find applications in various devices where efficient wire-to-board connections are essential, enhancing the overall reliability and ease of assembly in electronic systems.