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| Image | Part Number | Manufacturer | Description | Series | Packaging | RoHS Status | Manufacturer Part Number | Contact Finish | Contact Finish Thickness | Type | Pitch | Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 009176001711106 | AVX Corporation | CONN IDC 1 POS 20 AWG THRUCAP | 9176-700 | Cut Tape (CT) | - | - | Tin | - | - | - | - | |
| SIP110-PPJC-D14-SK-BK | Sullins Connector Solutions | CONN PLUG IDC .100" 28POS | - | Bulk | - | - | Gold | 15.0µin (0.38µm) | - | - | - | |
| XG2A-1001 | Omron | CONN SOCKET IDC 10POS .1X.1 | XG2 | Bulk | - | - | Tin | - | - | - | - | |
| 3-216791-4 | Agastat Relays / TE Connectivity | AMP LATCH D/P ASSY | AMP-Latch | Bulk | - | - | Tin | 118.1µin (3.00µm) | - | - | - | |
| 65494-013 | Amphenol FCI | CONN HEADER 40POS AU PCB T/H | Quickie™ | Tray | - | - | Gold | Flash | - | - | - | |
| 746610-9 | Agastat Relays / TE Connectivity | CONN PLUG IDC 40POS .1X.1 DIP | AMP-Latch | Bulk | - | - | Tin-Lead | 100.0µin (2.54µm) | - | - | - | |
| 90584-1326 | Affinity Medical Technologies - a Molex company | CONN RECEPT IDT 26POS 1.27MM TIN | Picoflex 90584 | Tube | - | - | Tin | 80.0µin (2.03µm) | - | - | - | |
| 2-1393536-1 | Agastat Relays / TE Connectivity | V23535B1780C500=BKLEV413 VERBI | - | Bulk | - | - | Tin | 196.9µin (5.00µm) | - | - | - | |
| 05DB-4K(LF) | JST | CONN IDC DB 5POS 2.5MM BLK PCB | DB | Bulk | - | - | Tin-Lead | - | - | - | - | |
| SIP110-PPPC-D20-SK-BK | Sullins Connector Solutions | CONN PLUG IDC .100" 40POS | - | Bulk | - | - | Gold | Flash | - | - | - |
Board in, direct wire to board connectors play a crucial role in the electronics industry by providing a direct and secure connection between wires and printed circuit boards (PCBs). These connectors eliminate the need for additional wire termination methods, allowing for a streamlined and space-efficient integration of wires into electronic assemblies. They find applications in various devices where efficient wire-to-board connections are essential, enhancing the overall reliability and ease of assembly in electronic systems.