Modular Connectors - Plugs

Modular Connectors - Plugs

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Manufacturer
Series
Ingress Protection
Features
Current Rating
Packaging
RoHS Status
Contact Material
Contact Finish
Contact Finish Thickness

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Image Part Number Manufacturer Description Series Ingress Protection Features Current Rating Packaging RoHS Status Contact Material Contact Finish Contact Finish Thickness
940-SP-360808-031-A108 Bel CONN MOD PLUG 8P8C SHIELDED 36 - Molded Boot 1.5A Bulk - Phosphor Bronze Gold 50.0µin (1.27µm)
SS-39200-011 Bel CONN MOD PLUG 8P8C SHIELDED 39 - Molded Boot - Bulk - Copper Alloy Gold 50.0µin (1.27µm)
09451511561 HARTING CONN MOD PLUG 8P8C SHIELDED RJ Industrial® IP20 Angled - 45° 1.5A Bulk - Nickel Gold 50.0µin (1.27µm)
943-SP-370808SM2-A233 Bel CONN MOD PLUG 8P8C SHIELDED 37 - Molded Boot 1.5A Bulk - Phosphor Bronze Gold 50.0µin (1.27µm)
SS-39200-014 Bel CONN MOD PLUG 8P8C SHIELDED 39 - Strain Relief - Bulk - Copper Alloy Gold 50.0µin (1.27µm)
9451151520 HARTING CONN MOD PLUG 8P8C SHIELDED Han® 3A IP65/67 - Dust Tight, Water Resistant, Waterproof Cable Clamp, Housing 1.5A Bulk - Nickel Gold 50.0µin (1.27µm)
09451511526 HARTING RJ INDUSTRIAL RJ45, 8PIN CAT6A G - - - - - - - - -
IO-EC-X Io Audio Technologies PRO ETHERCON CONNECTOR - - - - Bulk - - - -
940-SP-3088-OB-B25 Bel CONN MOD PLUG 8P8C UNSHIELDED 30 - - 1.5A Bulk - Phosphor Bronze Gold 50.0µin (1.27µm)
09451451560 HARTING CONN MOD PLUG 8P8C SHIELDED Han® PushPull IP65/67 - Dust Tight, Water Resistant, Waterproof - 1.5A Bulk - Nickel Gold 50.0µin (1.27µm)

About Modular Connectors - Plugs


Modular connectors with plugs are essential components in the electronics industry, offering a versatile and standardized solution for connecting various devices and equipment. These connectors feature male plugs with specific configurations of pins or contacts, allowing for easy and reliable connections with corresponding jacks or receptacles. Commonly used in data communication, audio-visual systems, and telecommunication equipment, modular connectors with plugs provide a convenient and modular approach to device connectivity.