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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Packaging | Mounting Type | Housing Material | Color | Shielding |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 5406296-1 | Agastat Relays / TE Connectivity | CONN MOD JACK 8P8C R/A SHIELDED | - | -40°C ~ 85°C | - | Board Guide | Tray | Through Hole | Polyamide (PA), Nylon | - | Shielded, EMI Finger | |
| 0956225881 | Affinity Medical Technologies - a Molex company | R/A SMT MODULAR JACK 1.05 PEGS | 95622 | -40°C ~ 85°C | - | Board Guide | Tape & Reel (TR) | Surface Mount | Liquid Crystal Polymer (LCP), Glass Filled | - | Shielded | |
| E560X-XXGG6X-L | Pulse Electronics Corporation | IC CHIP | - | - | - | - | - | - | - | - | - | |
| RJSNE5F81A8 | Amphenol Commercial Products | CONN MOD JACK 8P8C R/A SHLD | RJSNE | -40°C ~ 85°C | - | Board Lock | Tray | Through Hole | Thermoplastic | - | Shielded | |
| FRJAE486 | Amphenol Commercial Products | CONN MOD JACK 8P6C R/A SHIELDED | FRJAE | -55°C ~ 85°C | - | Board Lock | Tray | Through Hole | Thermoplastic | - | Shielded | |
| RV6MJKURD-B24 | Belden | REVCONN CAT6+ JACK RED | - | - | - | - | - | - | - | - | - | |
| RJHSE338PA1 | Amphenol Commercial Products | CONN MOD JACK 8P8C VERT SHLD | RJHSE | -55°C ~ 85°C | - | Board Lock, Panel Stops | Tray | Through Hole | Thermoplastic | - | Shielded | |
| SS70100-006F | Bel | CONNECTOR | 70 | - | - | Board Guide | Bulk | Through Hole | Thermoplastic | - | Shielded | |
| E8144-J02031 | Pulse Electronics Corporation | IC CHIP | - | - | - | - | - | - | - | - | - | |
| E590X-X5GXXX-L | Pulse Electronics Corporation | IC CHIP | - | - | - | - | - | - | - | - | - |
Modular connectors with jacks are female receptacles designed to accept male plugs, facilitating the connection of devices and equipment. These connectors come in various configurations to accommodate different standards and applications, including Ethernet, telephone, and audio-visual systems. Modular connectors with jacks play a fundamental role in creating standardized and modular connectivity solutions, contributing to the versatility and interoperability of electronic devices.