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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Packaging | Mounting Type | RoHS Status | Contact Finish | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1-166500-2 | Agastat Relays / TE Connectivity | CONN SOCKET CRIMP 20-24AWG | AMPMODU | - | - | - | Tape & Reel (TR) | - | - | Gold | 30.0µin (0.76µm) | |
| 193837-7 | Agastat Relays / TE Connectivity | CONN PIN CRIMP 1/0AWG SILVER | - | - | - | 185A | Bulk | - | - | Silver | 200.0µin (5.08µm) | |
| 1-448139-6 | Agastat Relays / TE Connectivity | CONN PIN CONTACT SIZE 16 GOLD | - | - | - | - | Bulk | - | - | - | - | |
| 194081-1 | Agastat Relays / TE Connectivity | CONN PIN 1.04MM W/O LOUVER BAND | - | - | - | - | Bulk | - | - | Gold | 50.0µin (1.27µm) | |
| 1883433-1 | Agastat Relays / TE Connectivity | SZ8 COAX PIN - RG179 - GPR HEX C | - | - | - | - | Bulk | - | - | Gold | 50.0µin (1.27µm) | |
| 532924-3 | Agastat Relays / TE Connectivity | CONN PIN GUIDE 30GOLD 100 SERIES | HDI (High Density Interconnect) | - | - | - | Bulk | - | - | Gold | 30.0µin (0.76µm) | |
| 7-192038-7 | Agastat Relays / TE Connectivity | LA3,.394,.008 SILPL | Louvertac, LAIII | - | - | - | Bulk | - | - | Silver | 200.0µin (5.08µm) | |
| 1766817-1 | Agastat Relays / TE Connectivity | CONN PIN 10-32 INT THREAD SILVER | ICCON, Elcon | - | - | 35A | Bulk | - | - | Silver | 200.0µin (5.08µm) | |
| 1650146-3 | Agastat Relays / TE Connectivity | CONN CONTACT PIN #12 | - | - | - | - | Bulk | - | - | Gold | 30.0µin (0.76µm) | |
| 6648232-1 | Agastat Relays / TE Connectivity | JUMPER CRN SKT | - | - | - | - | - | - | - | - | - |
Contacts in backplane connectors are the conductive elements responsible for establishing electrical connections within the connector system. These contacts are designed to ensure reliable and low-resistance connections, facilitating the transmission of signals or power between mated connectors. The quality and precision of contacts play a critical role in the overall performance and durability of backplane connectors in diverse electronic applications, including servers, data storage systems, and communication devices.