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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Packaging | Mounting Type | RoHS Status | Contact Finish | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2-192048-4 | Agastat Relays / TE Connectivity | LAVIS 0.10MM(.004) GOLD | Louvertac, LAVI | - | - | - | Bulk | - | - | Gold | 10.0µin (0.25µm) | |
| 030-2415-003 | Cannon | CONN CONTACT BUMP 18-20AWG GOLD | DL | - | - | - | Bulk | - | - | Gold | 50.0µin (1.27µm) | |
| 447853-3 | Agastat Relays / TE Connectivity | CONN SOCKET COAX SIZE 9 STRGHT | ARINC | - | - | - | Bulk | - | - | Gold | 50.0µin (1.27µm) | |
| 193837-1 | Agastat Relays / TE Connectivity | CONN PIN CRIMP 12-14AWG SILVER | - | - | - | - | Bulk | - | - | Silver | 200.0µin (5.08µm) | |
| 1766816-1 | Agastat Relays / TE Connectivity | CONN PIN #8 NON-LOCK #10 | ICCON, Elcon | - | - | - | Bulk | - | - | Silver | 200.0µin (5.08µm) | |
| 1663128-3 | Agastat Relays / TE Connectivity | CONN PIN ARINC 600 SIZE 16 SLD | ARINC 600 | - | - | 13A | Bulk | - | - | Gold | 50.0µin (1.27µm) | |
| 225791-5 | Agastat Relays / TE Connectivity | ARINC SKT SIZE 5 | ARINC | - | - | - | Bulk | - | - | Gold | 50.0µin (1.27µm) | |
| 448139-1 | Agastat Relays / TE Connectivity | CNCT SZ 16 PSTD PIN | - | - | - | - | Bulk | - | - | - | - | |
| 103-003-251-200 | EDAC Inc. | CONNECTOR - PRINTED CIRCUIT | 103 | - | - | 10A | Bulk | - | - | Gold | - | |
| 148249-1 | Agastat Relays / TE Connectivity | TYPE M CONT., CRIMP, 30AU | Eurocard | - | - | 20A | Bulk | - | - | Gold | 30.0µin (0.76µm) |
Contacts in backplane connectors are the conductive elements responsible for establishing electrical connections within the connector system. These contacts are designed to ensure reliable and low-resistance connections, facilitating the transmission of signals or power between mated connectors. The quality and precision of contacts play a critical role in the overall performance and durability of backplane connectors in diverse electronic applications, including servers, data storage systems, and communication devices.