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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Packaging | Mounting Type | RoHS Status | Contact Finish | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1-448139-1 | Agastat Relays / TE Connectivity | CONN PIN CONTACT SIZE 16 GOLD | ARINC 600 | - | - | - | Bulk | - | - | Gold | 50.0µin (1.27µm) | |
| 1648325-1 | Agastat Relays / TE Connectivity | CONN SOCKET #20 CRIMP GOLD | ELCON | - | - | 5A | Bulk | - | - | Gold | 30.0µin (0.76µm) | |
| 208267-4 | Agastat Relays / TE Connectivity | SKT CONTACT SZ 20 ARINC | ARINC | - | - | - | Bulk | - | - | Gold | 50.0µin (1.27µm) | |
| M39029/11-145 | Agastat Relays / TE Connectivity | ARINC PIN CONTACT SZ 20 | Military, MIL-C-39029, ARINC | - | - | - | Bulk | - | - | Gold | - | |
| 208268-3 | Agastat Relays / TE Connectivity | CONN PIN 20-16AWAG SIZE 16 | ARINC | - | - | - | Bulk | - | - | Gold | 50.0µin (1.27µm) | |
| 598489030000013 | AVX Corporation | DIN CONN | 8489 | - | - | - | Bulk | - | - | Gold | - | |
| 1766943-1 | Agastat Relays / TE Connectivity | CONTACT,PIN,1/4,THREADED | - | - | - | - | - | - | - | - | - | |
| 533082-3 | Agastat Relays / TE Connectivity | CONN PIN GUIDE FOR PLUG PLATED | HDI (High Density Interconnect) | - | - | - | Bulk | - | - | Gold | 30.0µin (0.76µm) | |
| 1393589-9 | Agastat Relays / TE Connectivity | CONN SOCKET 12-14AWG 20 AMPS | Eurocard | - | - | 20A | Bulk | - | - | - | 39.4µin (1.00µm) | |
| 221165-1 | Agastat Relays / TE Connectivity | CONTACT,SOCKET,SIZE 8,HDI,PURC | - | - | - | - | - | - | - | - | - |
Contacts in backplane connectors are the conductive elements responsible for establishing electrical connections within the connector system. These contacts are designed to ensure reliable and low-resistance connections, facilitating the transmission of signals or power between mated connectors. The quality and precision of contacts play a critical role in the overall performance and durability of backplane connectors in diverse electronic applications, including servers, data storage systems, and communication devices.